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Cluster Tool for Prototype Production (PECVD and Sputtering) |
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Fabrication of state of the art amorphous silicon,
nano- (or micro-) crystalline silicon, ITO, ZnO and metals.
Substrate size: 30cm x 40cm or larger. Process modules: o PECVD. Allows RF, VHF and pulsed plasma with modulation. o Sputtering (ITO, ZnO, metals)- oscillation during deposition. Uses rectangular cathodes. o Park Station with heat capability. o ITZ houses the robotic arm which works on a "pick and place" principle. o Load Lock with an elevator and cassette housing multiple substrates with carriers. Independently controlled process modules. Allows simultaneous depositions in all chambers. Computer controlled with optional data logging. Co-joining of cluster tools allows expansion and higher throughput. |
 Amorphous Silicon  Expandable for larger throughput  Cassette with an elevator for multiple substrate handling. |
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