Cluster Tools for R and D
From single chamber system to a complete cluster tool
with up to 7 process modules
 

 
Fabrication of state of the art amorphous silicon, nano- (or micro-) crystalline silicon, ITO, ZnO and metals.

Substrate size: 10cm x 10cm and 15cm x 15cm.

Process modules:
• PECVD. Allows RF, VHF and pulsed plasma with modulation.
• HWCVD.
• Sputtering (ITO, ZnO, metals)- oscillation during deposition.
• Laser Crystalization.
• Rapid Thermal Anneal.
• Park Station with heat capability.
• ITZ houses the robotic arm which works on a "pick and place" principle.
• Load Lock.
Independently controlled process modules. Allows simultaneous depositions in all chambers.

Computer controlled with optional data logging.

View a movie of our robotic arm in action