Cluster tools eliminate cross-contamination in multi-layer thin film structures and allow the production of high-quality electronic devices. Each MVSystems module as described below is controlled independently allowing simultaneous deposition in all chambers.

Vacuum: Ultra-high vacuum (UHV).

Substrate size: 10cmx10cm or 15.6cmx15.6cm.

Modules:

• PECVD: RF, VHF and pulsed (modulated) RF plasma.
• HWCVD.
• ALD.
• Sputtering (ITO, AZO, ZnON, metals, etc) with oscillation.
• Laser crystallization.
• Rapid thermal annealing.
• Park station with heating capability
• Isolation and Transfer Zone (ITZ) with robotic arm (8 or 10 port locations)
• Load lock with the following options:
  • single substrate capability.
  • connection to glove box.
  • multi-substrate capability.
• In-situ characterization module

Control: Computer controlled with easy to use HMI and optional data logging.

Systems guarantees are defined in the contract and include*:

• Base pressure on each chamber
• Temperature calibration
• Uniformity and opto-electronic properties for each material defined in the contract
• Functionality of all systems

* These are demonstrated during the Factory (or First) acceptance test (FAT) and Site (or Second) Acceptance Tests (SAT)