Cluster Tool for R&D

Cluster tools eliminate cross-contamination in multi-layer thin film structures and allow the production of high-quality electronic devices. Each MVSystems module as described below is controlled independently allowing simultaneous deposition in all chambers.

Vacuum: Ultra-high vacuum (UHV).

Substrate size: 10cmx10cm or 15.6cmx15.6cm.


  • PECVD: RF, VHF and pulsed (modulated) RF plasma.
  • HWCVD.
  • ALD.
  • Sputtering (ITO, AZO, ZnON, metals, etc) with oscillation.
  • Laser crystallization.
  • Rapid thermal annealing.
  • Park station with heating capability
  • Isolation and Transfer Zone (ITZ) with robotic arm (8 or 10 port locations)
  • Load lock with the following options:
    • single substrate capability.
    • connection to glove box.
    • multi-substrate capability.
  • In-situ characterization module

Control: Computer controlled with easy to use HMI and optional data logging.

Systems guarantees are defined in the contract and include*:

  • Base pressure on each chamber
  • Temperature calibration
  • Uniformity and opto-electronic properties for each material defined in the contract
  • Functionality of all systems

* These are demonstrated during the Factory (or First) acceptance test (FAT) and Site (or Second) Acceptance Tests (SAT)